Alumina Ceramic Substrates

Aluminum substrate for thick-film printed circuits manufactured using a proprietary production system

This product uses high-purity aluminum and is manufactured under strict quality control, providing consistent quality and excellent performance.
In today’s rapidly evolving electronics industry, the development of tiny chips no larger than a fingertip greatly advances the information society. Chip resistors are essential basic components in electronic circuits.
Our ceramic substrates for chip resistors use high-purity alumina (96%), which performs excellently in electrical and thermal environments. Precision processing technology provides outstanding dimensional accuracy and excellent dicing performance.

Alumina Ceramic Substrates

Environmentally Friendly Alumina Green Sheet

After Forming

After Sintering

Finished Product

Advantages

  • Line Spacing: 0.1 mm 
  • Excellent surface condition (fine particles result in fewer pores, good smoothness, and high flatness)
  • Excellent dimensional accuracy (very few defects in outside dimensions, thickness, etc.)
  • Low Warpage
  • High Thermal Conductivity
  • High Mechanical Strength
  • Excellent Dicing Performance
  • Excellent Chemical Resistance

Applications

  • Chip Resistors
  • Chip Resistor Arrays (Multi-hole and Slotted Substrates)
  • Thin-Film Hybrid ICs
  • Insulating Substrates
  • Glazed Substrates

 Ceramic Substrate Product Table

Standard Products
SpecificationsUnit Size
(mm)
Substrate Dimensions
(mm)
Thickness (mm)Remarks
10050.95×0.4860.0×49.5
16081.5×0.870.0×60.0
21251.95×1.260.45×49.5
32163.0×1.570.0×60.0
06030.58×0.2860.0×49.5With Holes
1095 1005×21.0×0.9560.0×49.5With Holes
2092 1005×42.0×0.9560.0×49.5With Holes
1032 1608×43.2×1.560.0×49.5With Holes

 Standard Properties of Ceramic Substrates

Material NameCeramicsUnit
GradeKA-6KA-9
PurityAl2O3 96%Al2O3 99%%
Water Absorption00%
Specific Gravity3.753.8g/cm³
Surface Roughness33μRmax
Hardness (HV)14.716.7GPa
Coefficient of Linear Expansion (40–800°C)7.87.910-6/℃
Thermal Conductivity2529W/(m·K)
Flexural Strength294313MPa
Withstand Voltage10 or Higher10 or HigherkV/mm
Volume Resistivity1014or Higher1014or HigherΩ·cm
Relative Permittivity1010(1MHz)
Dielectric Loss Tangent (1 MHz)4210-4
Dielectric Loss--(1MHz)