High-Brightness LED Package Chips

In recent years, as electronic devices have become smaller, lighter, and more advanced, heat dissipation from high-quality, high-density circuit boards has attracted increasing attention.
Because alumina offers excellent heat resistance, it is an important alternative to resin materials.

Features

  • Features of alumina substrates (heat resistance, chemical resistance, heat dissipation, etc.) 
    Suitable for thick-film substrates

    Stepped structure with flexibility
    Fine-tip machining
    Inner-surface machining
    Bonded substrates
    Others

Applications

  • High-brightness LED package chips, etc.
  • Other Related Applications