IXEPLAS Inorganic ION Capture Agent
IXEPLAS is a high-performance ION Capture Agent independently developed by Toagosei. Compared with conventional IXE, it offers greater ion-capture capacity and superior heat resistance. It effectively improves the long-term reliability of encapsulation materials and is also suitable for advanced semiconductor packaging and other applications with stringent ion-contamination control requirements, providing more stable and reliable performance for electronic devices.
Features
· A submicron material suitable for circuit-board encapsulation fillers and narrow-gap sealing.
· Fine particles provide a larger specific surface area and excellent performance at low addition levels.
· Excellent capture of copper and silver ions; suitable for encapsulating copper bonding wires and silver wiring.
· A dual ion-exchange type that provides effective ion capture over a wide pH range.
· Low impurity content, with virtually no adverse effect on encapsulation materials.
· Contains no RoHS-restricted substances.
Mechanism
Finer particle size, lower addition level, higher efficiency.
Thanks to its ultrafine particle size, IXEPLAS delivers excellent ion-capture performance at a lower addition level than IXE.
Applications
· IC encapsulation materials (EMC, liquid encapsulants, underfill materials, and die-attach materials)
· FPC adhesives
· Solar-cell components (backsheets and encapsulation resins)
· Resist inks
Application Examples
● Suppression of copper-wire migration
· IXEPLAS provides excellent copper-ion capture and effectively suppresses copper-ion migration.
· Ideally suited for encapsulating copper bonding wires and copper wiring.
· Can also be used to suppress ion migration in silver wiring.
Test Conditions
· Epoxy acrylate + urethane acrylate resin: 98 parts; IXEPLAS-A1: 1.0 part
· Wiring width: 50 μm; wiring spacing: 50 μm
· Damp-heat bias test (85°C, 85% relative humidity (RH), 50 V; test durations: 500 and 1,000 hours)
● Corrosion-suppression test for aluminum wiring
· Adding IXEPLAS to encapsulation resin effectively suppresses wiring corrosion and improves package reliability.
· Because IXEPLAS has a fine particle size, only a small addition is required to deliver excellent performance.
Rate of Increase in Aluminum-Wire Resistance
· Adding IXEPLAS to encapsulation resin effectively suppresses wiring corrosion and improves package reliability.
· Because IXEPLAS has a fine particle size, only a small addition is required to deliver excellent performance.
Test Conditions
· Adding IXEPLAS to encapsulation resin effectively suppresses wiring corrosion and improves package reliability.
· Because IXEPLAS has a fine particle size, only a small addition is required to deliver excellent performance.
IXEPLAS Grade List
| Grade | Reaction Type | Particle Size (nm) | Composition | Ions Captured | Heat Resistance (°C) | Features |
|---|---|---|---|---|---|---|
| IXEPLAS-A1 | Dual Ion Exchange | 500 | Zr-, Mg-, and Al-Based | Na+、Cu2+、Ag+ | ~300 | Standard Grade |
| IXEPLAS-A2 | Dual Ion Exchange | 200 | Zr-, Mg-, and Al-Based | Na+、Cu2+、Ag+ | ~300 | Finer than IXEPLAS-A1, with superior Cu2+ capture performance |
| IXEPLAS-A3 | Dual Ion Exchange | 500 | Zr-, Mg-, and Al-Based | Na+、Cu2+、Ag+ | ~300 | Suitable for Solvent-Based Systems |
| IXEPLAS-B1 | Dual Ion Exchange | 400 | Zr- and Bi-Based | Na+, Cl−, and Organic Acids | ~300 | Excellent Cl− capture performance |